Products
Discover how our comprehensive solutions empower your journey.
High Temperature Cushion Pad
——NAWES MAT ™
To support new 5G materials and high-standard bonding in electronics, while following industry environmental trends, our R&D team has launched NAWES MAT, a high-temperature cushioning material that replaces kraft paper.
Tooling Plate/ Carrier Plate
Tooling Plate/ Carrier Plate
We agent two imported bearing discs/covers: DILLIDUR-450 (Germany) and HARDOX-450 (Sweden), meeting MASSLAM & PINLAM machining accuracy and industry performance requirements.
Steel Press Plate/Separator Plate
We agent Japanese metallurgy & German mirror steel plates (original imports): NAS630, NAS301, 4120, 4310 (high expansion coefficient) precipitation hardening steels. Advantages: low cost, high parallelism, short delivery, QR traceability, fast technical service.
Release Film
Release film designed and manufactured for FPC and Rigid-Flex board production scenarios.
IN PARTNERSHIP WITH
Huanyuchang Electronic Technology Co,. Ltd.
Core Products The company specializes in PCB lamination peripheral materials and high-temperature buffer pads, offering four main series:
Cover/Carrier Plate
Cushion Pad
Separator Plate(Steel Plate)
ReleaseFilm
Applications & Vision Products are widely used in PCB, FPC, CCL, aluminum substrates, and new energy fields. HuanYuchang is dedicated to providing professional lamination materials and customized services, aiming to be a solid partner for clients and a leader in the electronics industry.

Vertical Product System Solutions
A Comprehensive, High-Precision Pressing Solution to Safeguard Advanced PCB Manufacturing

High-Performance CCL Lamination Accessories for PCB Manufacturing

Precision Lamination Accessories for Multilayer PCB Manufacturing

FPC Lamination Accessories – Optimized for Flexible Circuit Manufacturing

HDI Lamination Accessories – Precision Support for High-Density PCB Manufacturing
Events & News
Whether Semiconductor Industry Requires High-Temperature resistance Materials or not?
Whether Semiconductor Industry Requires High-Temperature resistance Materials or not? The semiconductor industry relies on high-temperature resistance materials due to extreme manufacturing conditions. Key Reasons: High-Temperature Processes – Wafer bonding (300–1000°C), thin-film deposition (CVD/PVD), and die-attach sintering (200–400°C) demand heat-resistant materials. Critical Applications – Used in bonding fixtures, encapsulation, and temporary bonding for 3D ICs. Material Requirements – Must withstand high temperatures, resist…
Meet Chang Universal Electronics at TPCA Show 2025 – Your Partner for High-Temp Lamination Solutions
Meet Shenzhen Chang Universal Electronics at TPCA Show 2025 – Your Partner for High-Temp Lamination Solutions SHENZHEN, CHINA – Shenzhen Chang Universal Electronics Co., Ltd., a leading integrated manufacturer and supplier of high-performance lamination accessories, is excited to announce its participation in the prestigious Taiwan Circuit Board Industry International Exhibition (TPCA Show) 2025. Visit us at Booth…
PCB Press Cushion Pad, NAWES MAT Introduction.
Shenzhen Chang Universal Electronics Co., Ltd research & develop a new material : Press cushion pad. It is a revolutionary solution meticulously designed for the lamination processes of Printed Circuit Boards (PCB), Copper-Clad Laminates (CCL), and Flexible Printed Circuits (FPC). Its primary function is to provide superior cushioning, ensuring a seamless and defect – free lamination process.…












